IEEE International 3D System Integration Conference (3DIC)
31 January - 2 February 2012, Osaka, Japan

3D-IC Summer School
6-9 February, 2012, Buenos Aires, Argentina

IEEE International Solid-State Circuits Conference (ISSCC)
Features at least two important papers on 3D-ICs
19-23 February 2012, San Francisco, CA

8th International Conference and Exhibition on Device Packaging
Includes "2.5D & Advanced 3D Packaging"
5-8 March 2012, Scottsdale/Fountain Hills, AZ

China Semiconductor Technology International Conference (CSTIC)
Focus sessions and course on 3D IC
18-19 March 2012, Shanghai, China

Electronic Components and Technology Conference (ECTC)
29 May - 1 June 2012, San Diego, CA

International Interconnect Technology Conference (IITC)
3-6 June 2012, San Jose, CA

Symposia on VLSI Technology & Circuits
Includes 3D (TSV) and heterogeneous integration
12-15 June 2012, Honolulu, HI

3D-Test
8-9 November 2012, Anaheim, CA

3-D Architectures for Semiconductor Integration and Packaging
(Technology Venture Forum, RTI)
12-14 December 2011, Burlingame, CA

The 3D Packaging Revolution
9 December 2011, San Jose, CA

3D Integrated Circuits: Technologies Enabling the Revolution
9 December 2011, Newport Beach, CA

Electronics Packaging Technology Conference (EPTC)
7-9 December 2011, Singapore

IP-Embedded System Conference (IP-SOC)
Included 3D-IC architectures
7-8 December 2011, Grenoble, France

Challenges and Emerging Solutions in Testing TSV-Based 2.5D- and 3D-SICs
21 November 2011, Webinar (online)

Global Interposer Technology Workshop (GIT 2011)
14-15 November 2011, Atlanta, GA

MEPTEC: 2.5, 3D and Beyond
9 November 2011, Santa Clara, CA

International System-on-Chip Conference (9th SoC)
Included panel: "3D: Where are we today; Where are we going; and How will you get there with us?"
2-3 November 2011, Newport Beach, CA

IEEE - EPEPS 2011 (Electrical Performance  of Electronic Packaging and Systems)
Included 3D interconnects, 3D packages, TSVs and MCMs
24-26 October 2011, San Jose, CA

SEMI North America Standards Fall 2011 Meetings
Included Three-Dimensional Stacked Integrated Circuits (3DS-IC)
24-27 October 2011, San Jose and Santa Clara, CA

SEMICON Europa,
SEMI Advanced Packaging Conference, and
Workshop on Stress Management for 3D IC‘s Using Through Silicon Vias
In conjunction with SEMATECH
11-13 October 2011, Dresden, Germany.

IMAPS 2011 - Long Beach
Included 3D Integration and Packaging Track
9-13 October 2011, Long Beach, CA

Advanced Metallization Conference 2011
Featured several 3-D presentations
4-6 October 2011, San Diego, CA

IWLPC (International Wafer-Level Packaging Conference)
Strong focus on 3-D integration and packaging
3-6 October 2011, Santa Clara, CA

3D Test Workshop 2011
22-23 September 2011, Anaheim, CA

European Solid-State Device Research Conference (ESSDERC 2011)
Included 3D devices, heterogeneous integration, 3D IC memory stacks, etc.
12-16 September, Helsinki, Finland

European Microelectronics Packaging Conference (EMPC 2011)
Included 3D-IC, TSV, and More Than Moore
12-15 September 2011, Brighton, England

SEMICON Taiwan 2011
Included 3D-IC Technology Forum, 3D-IC Pavilion, SiP Global Summit
7-9 September 2011, Taipei, Taiwan

SEMATECH Workshop on Metrology for 3D Interconnect
13 July 2011, San Francisco, CA

3D System Integration Workshop
13 July 2011, Atlanta, GA

SEMICON West 2011
Included 3D-IC Summit, 3D-IC TechZONE, etc.
12-14 July 2011, San Francisco, CA

Pacific Rim Technical Conference & Exposition on Packaging and Integration (InterPACK'11)
6 - 8 July 2011, Portland, OR

Design for 3D Silicon Integration (D43D)
29 June - 1 July 2011, Grenoble, France

International Conference on Materials for Advanced Technologies (ICMAT 2011)
Included: 3D TSV Process and Design Challenges Symposium
26 June - 1 July 2011, Singapore

IMAPS Professional Development Courses (PDCs)
Part of IMAPS Mid-Atlantic Microelectronics Conference
Included 3D Integration: Technology, Applications & Markets for 3D Integrated Circuits
23-24 June 2011, Atlantic City, NJ

CMOS Emerging Technologies Workshop (CMOSET)
15-17 June 2011, Whistler, BC, Canada

Technology and Instrumentation in Particle Physics (TIPP) 2011
Included "Satellite meeting on 3D electronics"
9-14 June 2011, Chicago, IL

Design Automation Conference (DAC)
Included "3-D IC: Myth or Miracle" - "Killer Apps for 3-D ICs" - "3-D IC Design" - "3-D: Devils, Details, and Debate"
5-10 June 2011, San Diego, CA

CMC 3D-IC Technical Webinar Series
6 June, 20 June 2011 (also April 20, 9 May); online

System Level Interconnect Prediction (SLIP 2011)
Included session & panel on 3D
5 June 2011, co-located with DAC (see following)

Electronic Components and Technology Conference (ECTC 2011)
Included advanced packaging, interconnects, and 8 sessions on 3D/TSV
31 May - 3 June 2011, Lake Buena Vista, FL

imec Technology Forum
25-26 May 2011, Brussels, Belgium

8th International Meeting on Front-End Electronics
Included session on "3D/Vertical Integration and Advanced Interconnections"
24-27 May 2011, Rome, Italy

International Memory Workshop
Included sessions on 3D memory
22-25 May 2011, Monterrey, California

SEMICON Singapore
Advanced packaging sessions addressed 3D-IC
11-13 May 2011, Singapore

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing (MiNaPAD) Forum
11-12 May 2011, Grenoble, France

Military Microelectronics
Included 3D technology
9-11 May 2011, Washington D.C.

iMAPS New England
Included 3D and High Density Packaging
3 May 2011, Boxborough, MA

ITAC and GSA Conference
"3D ICs - The Leading Driver for Next Generation Microelectronics?"
13-14 April 2011, Montreal, Quebec
28 April 2011, Vancouver, British Columbia

Electronic Design Process (EDP) Symposium
3D-IC was one of five main themes; included 3D panel
7-8 April 2011, Monterey, CA

GSA Memory Conference
"3D Architecture with Logic and Memory Integrated Solutions"
31 March 2011, San Jose, CA

North America Standards Spring 2011 Meetings
Included new task group for Three-Dimensional Stacked Integrated Circuits (3DS-IC) on 29th
28-31 March 2011, San Jose, CA

International Symposium on Physical Design (ISPD2011)
Included "Physical Design for 3D ICs"
27-30 March 2011, Santa Barbara, CA

Design for Reliability Workshop: Stress Management for 3D ICs Using Through Silicon Vias (Part of ISQED)
17 March 2011, Santa Clara, CA

DATE (Design, Automation, & Test in Europe) 2011
Included 3D Integration Workshop
C Manufacturing, CAD and Thermal-Aware Design for 3D System-on-Chip Design
14-18 March 2011, Grenoble, France

International Symposium on Quality Electronic Design (ISQED)
Included a 3D tech session, several papers, workshop 
14-16 March 2011, San Jose, CA

China Semiconductor Technology International Conference (CSTIC)
Included 3D-IC papers & sessions, in conjunction with SEMICON China
13-14 March 2011, Shanghai, China

IMAPS 3D IC & Packaging Workshop
7-10 March 2011, Scottsdale, AZ

The Business of Semiconductor Packaging in the Era of 3D and Energy Efficiency
(IMAPS Global Business Council)
6-7 March 2011, Scottsdale, AZ