SEMICON West 2010
Includes 3D interconnect challenges workshop
13-15 July 2010, San Francisco, CA

SEMICON Taiwan 2010
Includes 3D IC & Advanced Packaging/Testing Pavilion and 3D IC Technology Forum
8-10 September 2010,  Taipei, Taiwan

SEMICON Europa Advanced Packaging Conference
and workshop: Stress Management for 3D-ICs Using TSV
19-20 October 2010, Dresden, Germany

3D Test Workshop
4-5 November 2010, Austin, TX

IEEE International 3D System Integration Conference (3DIC)
16-18 November 2010, Munich, Germany

3-D Architectures for Semiconductor Integration and Packaging
(Technology Venture Forum, RTI)
8-10 December 2010, Burlingame, CA

IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
11-13 July 2010, San Francisco, CA

International Forum on Embedded MPSoC and Multicore (MPSoC '10)
28 June - 2 July 2010, Gifu City, Japan

Design Automation Conference (DAC) 2010
13-18 June 2010, Anaheim, California

2010 IEEE International Interconnect Technology Conference (IITC)

7-9 June 2010, Burlingame, California

60th Electronic Components and Technology Conference (ECTC)

1-4 June 2010, Las Vegas, Nevada

SEMICON Singapore 2010

19-21 May 2010, Singapore
Featured a "technology focused pavilion" for 3D IC & Wafer Level Packaging

International Conference on Electronics Packaging (ICEP) 2010

12-14 May 2010, Hokkaido, Japan 

6th International Conference and Exhibition on Device Packaging (IMAPS)

9-11 March 2010, Fountain Hills, Arizona

3D IC Integration: The Next Generation of Electronics (IEEE Meeting)

10 March 2010, Santa Clara, CA
Dinner & presentation

Design, Automation, & Test in Europe (DATE)

8-12 March 2010, Dresden, Germany
Friday (12th) was a day-long 3D integration workshop.

Burn-in & Test Socket Workshop (BiTS)

7-10 March 2010, Mesa, Arizona
Included a session on 3D IC testing

Pan Pacific Microelectronics Symposium

26-28 January 2010, Kauai, Hawaii
Included papers on 3D.

Asia & South Pacific Design Automation Conference (ASP-DAC 2010)

18-21 January 2010, Taipei, Taiwan
Included sessions & panels on 3D-ICs.

Korean 3D IC Workshop 2010

14-15 January 2010, Daejeon, Korea

Microelectronics Reliability & Qualification Workshop

8-9 December 2009, Manhattan Beach, Calif.

International Test Conference

1-6 November 2009, Austin, Texas
Included testing of 3D chips.

IMAPS 2009

November 1-5, 2009, San Jose, California
Included emerging technologies, 3D approaches.

International Wafer-Level Packaging Conference

October 27-30, 2009, Santa Clara, California
Included tracks on 3D-ICs

IMPACT 2009 and International 3D IC Conference

October 21-23 2009, Taipei, Taiwan

KGD Packaging & Test Workshop 2009

October 1-2, 2009, San Jose, California
With special focus on enabling KGD for 3D integration