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Upcoming 3D Events
 | "3D Stacked Packages:
Which Way to Go?"
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August 20, 2008,
Orlando, Florida
Panel discussion hosted by SMT magazine
Article
in SMT
| SMTA International Wafer Level
Packaging Conference
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October 13-16, 2008, San Jose,
California
Wafer-Level, 3D, Stacked Packaging, and Chip Scale
http://www.iwlpc.com/
| 25th VMIC (VLSI Multilevel
Interconnection Conference)
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October 27-30, 2008, Fremont,
California
http://www.imic.org
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Technology
Venture Fall Forum (RTI)
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November
17-19, 2008, Burlingame, California
Fifth annual "3D Architectures for Semiconductor
Integration and Packaging"
http://techventure.rti.org/fall2008/
Recent 3D Events
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SEMICON West
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July 15-17, 2008, San Francisco,
California
Panel: "It's a 3-D World: Charting the Path to TSV"
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11th Annual IEEE International
Interconnect Technology Conference (IITC 2008)
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June 1-4, 2008,
Burlingame, California
Focus on 3D: Processes, Integration, Interconnect Systems, etc.
http://www.his.com/~iitc/
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58th Electronic Components and
Technology Conference (ECTC)
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May 17-30, 2008,
Lake Buena Vista, Florida
Included advanced packaging and interconnects
http://www.ectc.net/ABOUT/2008/index.cfm
| Webcast: "Through-Silicon
Vias: Ready for Prime Time?"
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March 25, 2008, available for
viewing here:
http://www.semiconductor.net/webcastsDetail/2140165441.html
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4th
International Conference and Exhibition on Device Packaging (IMAPS)
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March
17-20, 2008, Scottsdale, Arizona
Included workshop on 3D
http://www.imaps.org/devicepackaging/
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3D All
Silicon System Integration (3DASSI)
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March
11-12, 2008, Atlanta, Georgia
Silicon
substrates, TSV, thermal issues, etc.
http://www.prc.gatech.edu/events/3dassi/index.htm
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Technology
Venture Fall Forum (RTI)
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October 22-24,
2007, Burlingame, California
Fourth annual "3D Architectures for Semiconductor
Integration and Packaging"
http://techventure.rti.org/fall2007/
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Thermal and Design Issues in 3D
ICs (SEMATECH Workshop)
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October 11-12, 2007, Albany, New
York
IC manufacturers, materials suppliers, CAD suppliers and users, 3D-TSV researchers
http://www.sematech.org/corporate/news/releases/20070924.htm
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24th VMIC (The Original Interconnect Conference)
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September 24 - 27, 2007, Fremont,
California
Included 3D-ICs, 3-D Systems, 3-D system- on- chip, vertical integration, wafer level
packaging
http://www.imic.org/2007-VMIC/index.html
© 2005-2008 3D-IC Alliance. All rights reserved. Revised: July 30, 2008
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