Papers & Articles about 3D ICs: 2003-2005

3D Integration (seven feature articles; subscription or purchase)
IEEE Design & Test, November-December 2005

New 3-D Chip Interconnect Technology
Semiconductor International, November 2005

Real demand drivers appear for 3D ICs if makers can produce them in volume
WaferNews, October 2005

Aligned Wafer Bonding for 3-D Interconnect
Semiconductor International, August 2005

3-D Integration at the Wafer Level -- TechSearch International, Autumn 2005

Business Microscope: 3-D Chip Trends -- InsideChips, July 2005

Implementing Caches in a 3D Technology for High Performance Processors -- Georgia Institute of Technology, 2005

Three-Dimensional ICs Solve the Interconnect Paradox -- Semiconductor International, June 2005

Wafer-Level 3D Hyper-Integration Technology Platform -- RPI, Spring 2005

Designing for New Dimensions -- Rensselaer Research Quarterly, Spring 2005

RTI International Holds Conferences on ... 3-D Chips -- RTI news release, May 2005

Future ICs Go Vertical -- Semiconductor International, February 2005

Wafer-to-Wafer Bonding Technology Drives the Growth of Vertical Systems Integration -- Chip Scale Review, February 2005

3D Interconnect Gets Real -- Solid State Technology, January 2005

Timing, Energy, and Thermal Performance of Three-Dimensional Integrated Circuits -- MIT, 2004

RF applications will follow the 3D Interconnect path, once adoption occurs in the digital domain -- RF Design, December 2004

The ups and downs of three-dimensional circuits -- Silicon Strategies, December 2004

Three firms to bring MEMs technology to a 3D interconnect challenge -- RF Design, December 2004

High-rise circuitry lures chip makers -- EE Times, November 2004

The Lowdown on High-Rise Chips -- Computer, October 2004

Techniques for Producing 3D ICs with High-Density Interconnect -- Tezzaron presentation at VMIC, September 2004

Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals -- Journal of Semiconductor Technology & Science, September 2004

3D interconnect is a top technical challenge -- ElectronicsWeekly, June 2004

How 3-D stacks up against SoCs -- EEdesign, May 2004

3-D ICs address SiP's technical shortfalls -- EETimes, May 2004

Technology Stalwarts Investigate 3D Interconnects -- Electronic News, April 2004

3D Interconnect Technology Coming to Light -- Electronic News, April 2004

3D IC Technology -- UCLA, Spring 2004

Sematech Pushes 3D Interconnects -- Electronic News, March 2004

Chips Go Vertical -- IEEE Spectrum, March 2004

Exploring Potential Benefits of 3D FPGA Integration -- U. of Minnesota, 2004

Wafer Bonding Enables New Technologies and Applications -- Semiconductor International, 2003

3D Integration -- Unaxis Wafer Processing, 2003

Multi-Dimensional Integration -- Semicon West 2003

Three-dimensional SoCs perform for future -- EEdesign, 2003

SoCs are 'dead,' Intel manager declares -- EETimes, 2003